High-density SSiC 3D-printed Lattices for Compact HTHP Aero-engine Recuperators

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Program:
HITEMMP
Award:
$1,846,000
Location:
Houghton, Michigan
Status:
ALUMNI
Project Term:
01/01/2020 - 12/31/2022
Website:

Technology Description:

Michigan Technological University will use advanced ceramic-based 3D printing technology to develop next-generation light, low-cost, ultra-compact, high-temperature, high-pressure (HTHP) heat exchangers. These will be able to operate at temperatures above 1100°C (2012°F) and at pressures above 80 bar (1160 psi). Current technologies cannot produce the high density, monolithic sintered silicon carbide (SSiC) material required for high temperature, high pressure recuperators. The team has invented a direct–ink writing technology for ceramics and techniques to 3D print high-density SSiC parts at scale, to reduce the risk of thermo-mechanical failure and ensure heat exchanger durability and quality.

Potential Impact:

HITEMMP projects will enable a revolutionary new class of heat exchangers and innovative approaches to advanced manufacturing with applications for a wide range of commercial and industrial energy producers and consumers.

Security:

High performance, efficient heat exchangers would increase industrial productivity, supporting domestic industries. The developed manufacturing techniques for high temperature materials could strengthen U.S. leadership in advanced manufacturing.

Environment:

More efficient electricity generation and industrial processes could significantly reduce emissions by enabling more efficient operations.

Economy:

HITEMMP technologies could enable more cost-effective, efficient, and compact modular power generation systems for multiple applications.

Contact

ARPA-E Program Director:
Dr. Philseok Kim
Project Contact:
Dr. Sajjad Bigham
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
sbigham@mtu.edu

Partners

Oak Ridge National Laboratory

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Release Date:
08/09/2018