Ultra-Energy-Efficient Integrated DWDM Optical Interconnect

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Program:
OPEN 2018
Award:
$3,191,608
Location:
Palo Alto, California
Status:
ALUMNI
Project Term:
04/01/2020 - 12/31/2023

Technology Description:

Hewlett Packard Labs will develop a low energy consumption, ultra-efficient, high-speed technology to transmit data as light in high-performance computing systems and data centers. The team will combine recent breakthroughs in low-cost laser manufacturing and ultra-efficient photonic tuning technology with their established platform. It will demonstrate a fully integrated optical transceiver capable of sending data faster than 1,000 gigabytes per second over 40 simultaneous channels, even in rigorous practical operating conditions with widely varying temperatures.

Potential Impact:

Hewlett Packard Labs will demonstrate a "bandwidth scale-up, energy scale-down, volume manufacturable” silicon photonic package solution.

Security:

This project will solidify US leadership in high-speed, low-cost, green photonics.

Environment:

Reducing the overall energy consumption of data centers cuts energy-related emissions per bit of data processed or stored.

Economy:

This project will enable a horizontally integrated and open photonic ecosystem for more silicon photonics innovators and beneficiaries and attract quick adoptions for emerging applications.

Contact

ARPA-E Program Director:
Dr. Olga Spahn
Project Contact:
Dr. Ray Beausoleil
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
ray.beausoleil@hpe.com

Partners

University of California, Santa Barbara

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Release Date:
12/13/2017