This document includes questions and answers that pertain to the ARPA-E Funding Opportunity Announcement (FOA) entitled "Cooling Operations Optimized for Leaps in Energy, Reliability and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS)".  The full solicitation on the COOLERCHIPS FOA and additional information can be found on the ARPA-E Funding Opportunity Exchange website (https://arpa-e-foa.energy.gov).