Compact Diffusion Bonded Printed-Circuit Heat Exchanger Development Using Nickel Superalloys for Highly Power Dense and Efficient Modular Energy Production Systems
Technology Description:
Vacuum Process engineering will develop a superalloy-based printed circuit heat exchanger for operation at temperatures exceeding 800°C (1472°F) and pressures above 80 bar (1160 psi). The team will build the heat exchanger applying a diffusion solid-state welding manufacturing technique, which uses stacked individual metal sheets with semi-circular channels formed from a chemical treatment process. The goal is to create a highly effective, high temperature compact heat exchanger with a high-strength bond during the welding capable of containing the very high pressure fluid at elevated temperatures. This project will enable increased deployment of clean, efficient, compact, and cost-effective power dense power production systems that will reduce energy-related emissions.
Potential Impact:
HITEMMP projects will enable a revolutionary new class of heat exchangers and innovative approaches to advanced manufacturing with applications for a wide range of commercial and industrial energy producers and consumers.
Security:
High performance, efficient heat exchangers could increase industrial efficiency, supporting domestic industries. The developed manufacturing techniques for high temperature materials could strengthen U.S. leadership in advanced manufacturing.
Environment:
More efficient electricity generation and industrial processes could significantly reduce emissions by enabling more efficient operations.
Economy:
HITEMMP technologies could enable more cost-effective, efficient, and compact modular power for multiple applications.