Compact Solid State Cooling Systems

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Program:
BEETIT
Award:
$520,547
Location:
Los Angeles, California
Status:
ALUMNI
Project Term:
10/01/2010 - 09/30/2012

Technology Description:

The University of California, Los Angeles (UCLA) is developing a novel solid state cooling technology to translate a recent scientific discovery of the so-called giant electrocaloric effect into commercially viable compact cooling systems. Traditional air conditioners use noisy, vapor compression systems that include a polluting liquid refrigerant to circulate within the air conditioner, absorb heat, and pump the heat out into the environment. Electrocaloric materials achieve the same result by heating up when placed within an electric field and cooling down when removed—effectively pumping heat out from a cooler to warmer environment. This electrocaloric-based solid state cooling system is quiet and does not use liquid refrigerants. The innovation includes developing nano-structured materials and reliable interfaces for heat exchange. With these innovations and advances in micro/nano-scale manufacturing technologies pioneered by semiconductor companies, UCLA is aiming to extend the performance/reliability of the cooling module.

Potential Impact:

If successful, UCLA would eliminate the use of polluting refrigerants in air conditioners used in buildings.

Security:

Increased energy efficiency would decrease U.S. energy demand and reduce reliance on fossil fuels—strengthening U.S. energy security.

Environment:

Refrigerants with polluting emissions could account for up to 10%-20% of global warming by year 2050. UCLA's technology could eliminate the use of these refrigerants.

Economy:

Widespread adoption of this technology could reduce energy consumption for air conditioning of buildings—providing consumers with cost savings on energy bills.

Contact

ARPA-E Program Director:
Dr. Dane Boysen
Project Contact:
Prof. Yongho Ju
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
just@seas.ucla.edu

Partners

Teledyne Scientific & Imaging, LLC

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Release Date:
03/02/2010