Confined Direct Two-phase Jet Impingement Cooling with Topology Optimized Surface Engineering and Phase Separation Using Additive Manufacturing

Default ARPA-E Project Image

Program:
COOLERCHIPS
Award:
$1,881,315
Location:
West Lafayette, Indiana
Status:
ACTIVE
Project Term:
09/26/2023 - 09/25/2026
Website:

Technology Description:

Purdue University, Binghamton University, and Seguente Inc. will develop an innovative chip-level direct two-phase impingement jet cooling solution to drastically enhance overall thermal performance while reducing pumping power. The design includes new algorithms for topology optimization of the cooling structure, novel on-chip direct printing methods for laser powder bed fusion of multi-porosity wicks, and an additively manufactured multi-input\multi-output fluid distribution manifold.

Contact

ARPA-E Program Director:
Dr. Jungho Kim
Project Contact:
Prof. Tiwei Wei
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
wei427@purdue.edu

Partners

Seguente, Inc.
State University of New York at Binghamton

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Release Date:
09/22/2022