Enabling Two-Phase Immersion Cooling to Support High TDP

Default ARPA-E Project Image

Program:
COOLERCHIPS
Award:
TBD
Location:
TBD
Status:
Selected
Project Term:
TBD
Website:

Technology Description:

Intel Federal will develop ultra-low-thermal resistance, coral-shaped immersion cooling heat sinks integrated with a 3D vapor chamber cavity for high-power devices. Intel’s design would address the challenge of adapting two-phase immersion cooling by optimizing 3D vapor chambers to spread the heat more effectively. This is paired with innovative boiling enhancement coatings to reduce thermal resistance by promoting high nucleation site density.

Contact

ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Mr. Tejas Shah
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
tejas1.shah@intel.com

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Release Date:
09/22/2022