High Energy Density Modular Heat Exchangers through Design, Materials Processing, and Manufacturing Innovations

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Program:
HITEMMP
Award:
$2,400,000
Location:
Pittsburgh, Pennsylvania
Status:
ACTIVE
Project Term:
09/16/2019 - 03/15/2024
Website:

Technology Description:

The Carnegie Mellon team will develop a modular radial heat exchanger that includes flow through pin arrays and counter-flow headers. The team will fabricate the heat exchanger via laser powder bed fusion additive manufacturing, with superalloys selected for high temperature and high pressure capability. Multiple approaches will be used to smooth the heat exchanger components’ internal passages to minimize pressure drop. Developing 3D metals printing technology for high temperature heat exchangers would radically remove constraints on heat exchanger design, making it a potentially disruptive technology.

Potential Impact:

HITEMMP projects will enable a revolutionary new class of heat exchangers and innovative approaches to advanced manufacturing with applications for a wide range of commercial and industrial energy producers and consumers.

Security:

High performance, efficient heat exchangers would increase industrial productivity, supporting domestic industries. The developed manufacturing techniques for high temperature materials could strengthen U.S. leadership in advanced manufacturing.

Environment:

More efficient electricity generation and industrial processes could significantly reduce emissions by enabling more efficient operations.

Economy:

HITEMMP technologies could enable more cost-effective, efficient, and compact modular power generation systems for multiple applications.

Contact

ARPA-E Program Director:
Dr. Philseok Kim
Project Contact:
Prof. Anthony Rollett
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
rollett@andrew.cmu.edu

Partners

National Energy Technology Laboratory

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Release Date:
08/09/2018