Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future

Default ARPA-E Project Image

Program:
COOLERCHIPS
Award:
$2,843,224
Location:
Arlington, Texas
Status:
ACTIVE
Project Term:
08/23/2023 - 08/24/2026
Website:

Technology Description:

The University of Texas at Arlington and collaborators will develop a novel hybrid cooling technology to address the growing need for advanced thermal management solutions for high-power data centers. At the server level, the design combines direct-to-chip evaporative cooling module including electrodeposition of metal on high-powered devices to eliminate thermal interface materials and to reduce chip-to-coolant thermal resistance, and air cooling including Rear Door Heat Exchanger for the rest of the system and thus enabling a robust and extendible solution for the future as well as an easy path to retrofit legacy data centers.

Contact

ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Prof. Dereje Agonafer
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
agonafer@uta.edu

Partners

University of Maryland
Illinois Institute of Technology

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Release Date:
09/22/2022