Holistic Rack-to-Processor Power and Thermal Co-Design for Future Servers
Technology Description:
The University of Illinois at Urbana-Champaign will develop an innovative cooling paradigm capable of both minimal energy use and maximum cooling power for future servers. Their design integrates high-performance thermal interface materials, coefficient of thermal expansion matched and reliable silicon carbide coolers, topology optimization-based design automation coupled with silicon carbide additive manufacturing, robust and cost-effective single-phase water cooling, and high primary-side temperatures to enable efficient heat dissipation to the ambient.
Contact
ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Prof. Nenad Miljkovic
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
nmiljkov@illinois.edu
Partners
Oak Ridge National Laboratory
University of California, Berkeley
University of Arkansas
University of Illinois, Urbana Champaign
Carnegie Mellon University
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Release Date:
09/22/2022