Hyperefficient Data Centers for Deep Decarbonization of Large-scale Computing

Default ARPA-E Project Image


Program:
COOLERCHIPS
Award:
$3,042,416
Location:
Gainesville, Florida
Status:
ACTIVE
Project Term:
09/18/2023 - 09/18/2026
Website:

Technology Description:

The University of Florida is developing a disruptive thermal management solution proposed for cooling future CPU and GPU chips at unprecedented heat flux and power levels in data centers server racks. The new technology allows for significant future growth in processor power, rejects heat directly to the ambient air external to the data center, and would facilitate adoption within the existing data center infrastructure with a primary liquid cooling loop.

Contact

ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Prof. Saeed Moghaddam
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
saeedmog@ufl.edu

Partners

Boyd Corporation
National Renewable Energy Laboratory
University of Maryland
University of Florida

Related Projects


Release Date:
09/22/2022