Hyperefficient Data Centers for Deep Decarbonization of Large-scale Computing

Default ARPA-E Project Image

Program:
COOLERCHIPS
Award:
$3,042,416
Location:
Gainesville, Florida
Status:
ACTIVE
Project Term:
09/18/2023 - 09/18/2026
Website:

Technology Description:

The University of Florida is developing a disruptive thermal management solution proposed for cooling future CPU and GPU chips at unprecedented heat flux and power levels in data centers server racks. The new technology allows for significant future growth in processor power, rejects heat directly to the ambient air external to the data center, and would facilitate adoption within the existing data center infrastructure with a primary liquid cooling loop.

Contact

ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Prof. Saeed Moghaddam
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
saeedmog@ufl.edu

Partners

Boyd Corporation
National Renewable Energy Laboratory
University of Maryland
University of Florida

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• HP - Embedded Microfluidic Cooling for Nextgen High Power Server Architectures
• HRL Laboratories - Aligned Graphite Microchannel Cooling (AGMC) System with Additively Manufactured Manifolds
• IBM T.J. Watson Research Center - Systems Two Phase Cooling
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• Intel Federal - Enabling Two-Phase Immersion Cooling to Support High TDP
• JetCool Technologies - Sub-One PUE through Silicon Cooling Efficiency
• National Renewable Energy Laboratory (NREL) - COOLERCHIPS Technical Evaluation Team
• Nokia of America - Delivering Energy & Exergy Efficiency in the Converged 5G RAN/Edge Compute Network
• Nvidia - Green Refrigerant Compact Hybrid System for Ultra-Efficient and Sustainable HPC Cooling
• Purdue University - Confined Direct Two-phase Jet Impingement Cooling with Topology Optimized Surface Engineering and Phase Separation Using Additive Manufacturing
• Raytheon Technologies Research Center - EXTRACT: Extra Efficient Data Centers Using Avionics Cooling Technology
• University of California, Davis (UC Davis) - Holistic Modular Energy-efficient Directed Cooling Solutions (HoMEDUCS) for Edge Computing
• University of Florida - Hyperefficient Data Centers for Deep Decarbonization of Large-scale Computing
• University of Illinois, Urbana-Champaign (UIUC) - Holistic Rack-to-Processor Power and Thermal Co-Design for Future Servers
• University of Maryland (UMD) - Multi-Objective Optimization Software for COOLERCHIPS
• University of Missouri - Dual-mode Hybrid Two-phase Loop for Data Center Cooling
• University of Texas at Arlington (UT Arlington) - Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future

Release Date:
09/22/2022