Prefab Modular Liquid-cooled Micro Data Center

Default ARPA-E Project Image


Program:
COOLERCHIPS
Award:
$3,499,951
Location:
Bethesda, Maryland
Status:
ACTIVE
Project Term:
01/23/2024 - 01/22/2027

Technology Description:

Flexnode will develop a prefabricated, modularly designed EDGE data center that will leverage four key component and system-level technology advancements: a novel manifold microchannel heatsink, a chassis-based hybrid immersion cooling approach, a cost-effective additive manufacturing-enabled dry cooling heat exchanger system, and a topology optimized container housing the entire system.

Contact

ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Mr. Tarif Abboushi
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
tarif@flexnode.io

Partners

University of Maryland
The Boeing Company

Related Projects


Release Date:
09/22/2022