Prefab Modular Liquid-cooled Micro Data Center

Default ARPA-E Project Image

Program:
COOLERCHIPS
Award:
$3,500,000
Location:
Bethesda, Maryland
Status:
ACTIVE
Project Term:
01/23/2024 - 01/22/2027
Website:

Technology Description:

Flexnode will develop a prefabricated, modularly designed EDGE data center that will leverage four key component and system-level technology advancements: a novel manifold microchannel heatsink, a chassis-based hybrid immersion cooling approach, a cost-effective additive manufacturing-enabled dry cooling heat exchanger system, and a topology optimized container housing the entire system.

Contact

ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Mr. Tarif Abboushi
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
tarif@flexnode.io

Partners

University of Maryland
The Boeing Company

Related Projects

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• Flexnode - Prefab Modular Liquid-cooled Micro Data Center
• HP - Embedded Microfluidic Cooling for Nextgen High Power Server Architectures
• HRL Laboratories - Aligned Graphite Microchannel Cooling (AGMC) System with Additively Manufactured Manifolds
• IBM T.J. Watson Research Center - Systems Two Phase Cooling
• Impact Cooling - High Density Cooling System for Ultra-Low PUE Data Centers
• Intel Federal - Enabling Two-Phase Immersion Cooling to Support High TDP
• JetCool Technologies - Sub-One PUE through Silicon Cooling Efficiency
• National Renewable Energy Laboratory (NREL) - COOLERCHIPS Technical Evaluation Team
• Nokia of America - Delivering Energy & Exergy Efficiency in the Converged 5G RAN/Edge Compute Network
• Nvidia - Green Refrigerant Compact Hybrid System for Ultra-Efficient and Sustainable HPC Cooling
• Purdue University - Confined Direct Two-phase Jet Impingement Cooling with Topology Optimized Surface Engineering and Phase Separation Using Additive Manufacturing
• Raytheon Technologies Research Center - EXTRACT: Extra Efficient Data Centers Using Avionics Cooling Technology
• University of California, Davis (UC Davis) - Holistic Modular Energy-efficient Directed Cooling Solutions (HoMEDUCS) for Edge Computing
• University of Florida - Hyperefficient Data Centers for Deep Decarbonization of Large-scale Computing
• University of Illinois, Urbana-Champaign (UIUC) - Holistic Rack-to-Processor Power and Thermal Co-Design for Future Servers
• University of Maryland (UMD) - Multi-Objective Optimization Software for COOLERCHIPS
• University of Missouri - Dual-mode Hybrid Two-phase Loop for Data Center Cooling
• University of Texas at Arlington (UT Arlington) - Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future

Release Date:
09/22/2022