Slick Sheet: Project
MicroLink Devices will engineer affordable, high-performance transistors for power conversion. Currently, high-performance power transistors are prohibitively expensive because they are grown on expensive gallium nitride (GaN) semiconductor wafers. In conventional manufacturing processes, this expensive wafer is permanently attached to the transistor, so the wafer can only be used once. MicroLink Devices will develop an innovative method to remove the transistor structure from the wafer without damaging any components, enabling wafer reuse and significantly reducing costs.

Slick Sheet: Project
SixPoint Materials will create low-cost, high-quality vertical gallium nitride (GaN) substrates for use in high-power electronic devices. In its two-phase project, SixPoint Materials will first focus on developing a high-quality GaN substrate and then on expanding the substrate’s size. Substrates are thin wafers of semiconducting material used to power devices like transistors and integrated circuits.

Slick Sheet: Project
Kyma Technologies will develop a cost-effective technique to grow high-quality gallium nitride (GaN) seeds into GaN crystal boules, which are used as the starting material for a number of semiconductor devices. Currently, growing boules from GaN seeds is a slow, expensive, and inconsistent process, so it yields expensive electronic devices of varying quality. Kyma will select the highest quality GaN seeds and use a proprietary hydride vapor phase epitaxy growth process to rapidly grow the seeds into boules while preserving the seed’s structural quality and improving its purity.

Slick Sheet: Project
Monolith Semiconductor will utilize advanced device designs and existing low-cost, high-volume manufacturing processes to create high-performance silicon carbide (SiC) devices for power conversion. SiC devices provide much better performance and efficiency than their silicon counterparts, which are used in the majority of today’s semiconductors. However, SiC devices cost significantly more. Monolith will develop a high-volume SiC production process that utilizes existing silicon manufacturing facilities to help drive down the cost of SiC devices.

Slick Sheet: Project
Avogy will develop a vertical transistor with a gallium nitride (GaN) semiconductor that is 30 times smaller than conventional silicon transistors but can conduct significantly more electricity. Avogy’s GaN transistor will function effectively in high-power electronics because it can withstand higher electric fields and operate at higher temperatures than comparable silicon transistors. Avogy’s vertical device architecture can also enable higher current devices.

Publications
Recent advances in wide band-gap (WBG) semiconductor materials, such as silicon carbide (SiC) and gallium nitride (GaN) are enabling a new generation of power semiconductor devices that far exceed the performance of silicon-based devices. Past ARPA-E programs (ADEPT, Solar ADEPT, and SWITCHES) have enabled innovations throughout the power electronics value chain, especially in the area of WBG semiconductors.

Impact Sheet
LOW-COST LEDS ON FLEXIBLE METAL TAPES UPDATED: JANUARY 27, 2017PROJECT TITLE: Epitaxial GaN on Flexible Metal Tapes for Low-Cost Transistor DevicesPROGRAM: Strategies for Wide Bandgap, Inexpensive Transistors for Controlling High-Efficiency Systems (SWITCHES)AWARD: $2,768,468PROJECT TEAM: iBeam Materials (Lead), Sandia National Laboratory, Los Alamos National Laboratory, University of New Mexico

Impact Sheet
LOWER COST GaN FOR LIGHTING AND ELECTRONICS EFFICIENCY UPDATED: MARCH 28, 2016 PROJECT TITLES:  Ammonothermal Growth of GaN Substrates for LEDs and Power ElectronicsPROGRAM: SWITCHES and OPEN 2009AWARD: $6,544,259PROJECT TEAM: SoraaPROJECT TERM: January 2011 to January 2016

Impact Sheet
A NEW MODEL FOR WIDE BANDGAP SEMICONDUCTOR MANUFACTURING IN THE U.S. UPDATED: MARCH 17, 2016 PROJECT TITLES: Advanced Manufacturing and Performance Enhancements for Reduced Cost Silicon Carbide MOSFETS (AMPERES) PROGRAM: SWITCHESAWARD:  $3,225,000PROJECT TEAM:  Monolith Semiconductor (Lead), X-Fab Texas, Rensselaer Polytechnic Institute, United Technologies Research Center, University of Arkansas 

Press Releases
ARPA-E has announced up to $6.5 million in funding for a new program that seeks to greatly improve the performance and reliability of power electronics semiconductor devices by overcoming the limitations of current fabrication methods.