COOLERCHIPS Technical Evaluation Team

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Program:
COOLERCHIPS
Award:
$1,463,319
Location:
Golden, Colorado
Status:
ACTIVE
Project Term:
01/08/2024 - 01/10/2027
Website:

Technology Description:

The National Renewable Energy Laboratory (NREL), Sandia National Laboratories, and the Georgia Institute of Technology will develop testing protocols to evaluate the cooling technologies developed by COOLERCHIPS projects in real data center operating conditions. The scale will range from the component level to the rack level and all the way up to full edge data centers. This technical evaluation team will leverage the work done by the COOLERCHIPS Category C team to develop a digital twin to evaluate key parameters and help test a broad range of technologies developed by other COOLERCHIPS project teams to evaluate their thermal, reliability, and cost goals.

Contact

ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
David Sickinger
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
david.sickinger@nrel.gov

Partners

Georgia Institute of Technology

Related Projects

• Chilldyne - Helical Turbulator for Robust Nucleate Boiling Cold Plate
• Flexnode - Prefab Modular Liquid-cooled Micro Data Center
• HP - Embedded Microfluidic Cooling for Nextgen High Power Server Architectures
• HRL Laboratories - Aligned Graphite Microchannel Cooling (AGMC) System with Additively Manufactured Manifolds
• IBM T.J. Watson Research Center - Systems Two Phase Cooling
• Impact Cooling - High Density Cooling System for Ultra-Low PUE Data Centers
• Intel Federal - Enabling Two-Phase Immersion Cooling to Support High TDP
• JetCool Technologies - Sub-One PUE through Silicon Cooling Efficiency
• National Renewable Energy Laboratory (NREL) - COOLERCHIPS Technical Evaluation Team
• Nokia of America - Delivering Energy & Exergy Efficiency in the Converged 5G RAN/Edge Compute Network
• Nvidia - Green Refrigerant Compact Hybrid System for Ultra-Efficient and Sustainable HPC Cooling
• Purdue University - Confined Direct Two-phase Jet Impingement Cooling with Topology Optimized Surface Engineering and Phase Separation Using Additive Manufacturing
• Raytheon Technologies Research Center - EXTRACT: Extra Efficient Data Centers Using Avionics Cooling Technology
• University of California, Davis (UC Davis) - Holistic Modular Energy-efficient Directed Cooling Solutions (HoMEDUCS) for Edge Computing
• University of Florida - Hyperefficient Data Centers for Deep Decarbonization of Large-scale Computing
• University of Illinois, Urbana-Champaign (UIUC) - Holistic Rack-to-Processor Power and Thermal Co-Design for Future Servers
• University of Maryland (UMD) - Multi-Objective Optimization Software for COOLERCHIPS
• University of Missouri - Dual-mode Hybrid Two-phase Loop for Data Center Cooling
• University of Texas at Arlington (UT Arlington) - Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future

Release Date:
09/22/2022