Green Refrigerant Compact Hybrid System for Ultra-Efficient and Sustainable HPC Cooling

Default ARPA-E Project Image

Program:
COOLERCHIPS
Award:
TBD
Location:
TBD
Status:
Selected
Project Term:
TBD
Website:

Technology Description:

Nvidia will develop a novel modular datacenter with an innovative cooling system that combines direct-to-chip, pumped two-phase and single-phase immersion in a rack manifold with built-in pumps and a liquid-vapor separator. The design cools chips with a two-phase cold plate, while the rest of the server components with lower power density will be submerged inside a hermetically sealed immersion sled with the servers cooled using green refrigerants for the twophase cooling and dielectric fluid for the immersion. The two-phase porous metal cold plate will achieve a thermal resistance as low as 0.0025°C/W.

Contact

ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Dr. Ali Heydari
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
aheydari@nvidia.com

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Release Date:
09/22/2022