Embedded Microfluidic Cooling for Nextgen High Power Server Architectures
Technology Description:
As part of their Category A effort, HP will work with partners to develop an aggressive liquid cooling solution that reduces the need for thermal interface material and the number of thermal interfaces between high-power CPUs/GPUs and the coolant, thereby dramatically lowering the package thermal resistance. The proposed approach leverages HP’s inkjet microfluidics platform and relies on first coupling silicon microchannels to a device’s surface, and then by embedding microfluidics deeper into the device as a future step. This design would reject server heat to 40°C and 60% relative humidity external ambient air.
Contact
ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Mr. Michael Cumbie
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
michael.cumbie@hp.com
Related Projects
Release Date:
09/22/2022