Sub-One PUE through Silicon Cooling Efficiency

Default ARPA-E Project Image

Program:
COOLERCHIPS
Award:
$1,292,719
Location:
Littleton, Massachusetts
Status:
ACTIVE
Project Term:
09/26/2023 - 01/07/2027
Website:

Technology Description:

JetCool will develop a microconvective cooling technology that combines and optimizes two distinct cooling approaches to provide the highest levels of energy efficiency in data centers. JetCool’s micro-convective cooling modules lower CPU temperatures, reducing leakage current and resulting in power savings of 8-10% while an in-server radiator eliminates the need for server-dedicated air cooling in the data center to provide significant additional energy savings.

Contact

ARPA-E Program Director:
Dr. Peter de Bock
Project Contact:
Dr. Ludwig Haber
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
lhaber@jetcool.com

Partners

Sandia National Laboratory

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• University of Texas at Arlington (UT Arlington) - Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future

Release Date:
09/22/2022