Holistic Modular Energy-efficient Directed Cooling Solutions (HoMEDUCS) for Edge Computing

Default ARPA-E Project Image

Program:
COOLERCHIPS
Award:
$3,586,473
Location:
Davis, California
Status:
ACTIVE
Project Term:
09/26/2023 - 09/25/2026
Website:

Technology Description:

The University of California, Davis, will develop a suite of holistic thermal management solutions for modular datacenters used for edge computing. Their design innovations include efficient heat extraction from CPU and GPU chips with a liquid cooled loop and dissipation of this heat to the ambient by use of high-efficiency, low-cost heat exchangers. Auxiliary electronics in the server boards would be cooled with a secondary loop that rejects heat radiatively to the atmosphere.

Contact

ARPA-E Program Director:
Dr. Jungho Kim
Project Contact:
Prof. Vinod Narayanan
Press and General Inquiries Email:
ARPA-E-Comms@hq.doe.gov
Project Contact Email:
vnarayanan@ucdavis.edu

Partners

University of Michigan
R&D Products, Inc.
GEM 360

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Release Date:
09/22/2022